Patterned Wafers

COPPER CMP*

*Barrier materials: Ta, TaN, TiN; Electroplate thickness ranges: 7KA-15KA Cu

MASK SET	PRODUCT DESCRIPTION	WAFER SIZE	MINIMUM FEATURE SIZE	TYPICAL ETCH DEPTH	TYPICAL FILMS AVAILABLE
854/455	Damascene CMP test mask contains serpentine structures of varying CD, density/pitch. Structures are electrically testable for quantitative measurement of dishing/erosion impact, have large arrays for profilometry/AFM, & are easily cleaveable for FIB/SEM imaging. Feature size range: 180nm up to 100um Design also contains a module with various dielectric slotting in large 100um metal lines for testing dishing vs. metal area.	200 mm 300 mm	180 nm	5KA	· PETEOS · SiN · Silox · Coral · Black Diamond
454	854 design with added tiling, SRAM cells, logic cells, variable linewidth serpentines, metrology boxes, VHORGs, RVB/BTS structures for voltage or thermal breakdown, & others, extended down to 100nm feature size	200 mm 300 mm	100 nm	﹤3KA	· PETEOS · SiN · Silox · Coral · Black Diamond

STI FILL CMP

MASK SET	PRODUCT DESCRIPTION	WAFER SIZE	MINIMUM FEATURE SIZE	TYPICAL ETCH DEPTH	TYPICAL FILMS AVAILABLE
864 / 464	STI CMP mask, including vertical & horizontal trenches at varying density	200 mm & 300mm	500nm	5KA	· polySi · thermal oxide · SiN · TEOS or HDP oxide fill
474	STI CMP mask containing pattern rec features, various trench densities at vertical & horizontal orientation, posts/holes, litho/etch monitor module, & iso/dense trench module Feature sizes from 250nm up to 250um	200 mm 300 mm	250 nm	3KA	· PETEOS · SiN · Silox · Coral · Black Diamond
484	STI CMP mask designed with input from CMP & material suppliers Includes enhanced metrology structures, various trench densities at vertical and horizontal orientation, isolated trench module, post/hole module, & SRAM test module Feature sizes from 130nm up to 500um	200 mm 300 mm	130 nm	2KA	· PETEOS · SiN · Silox · Coral · Black Diamond

ELECTRICAL TEST VEHICLES

MASK SET	PRODUCT DESCRIPTION	WAFER SIZE	MINIMUM FEATURE SIZE	TYPICAL ETCH DEPTH	TYPICAL FILMS AVAILABLE
461	Capacitance-voltage (CV dot) maskset Electrically testable, 2-layer set; includes clearfield and darkfield masks Dots 11um up to 3.5mm	200 mm & 300mm	arge capacitors	﹤4KA	request
400	Cu damascene design similar to 800 maskset, extended down to 130nm	200mm, 300mm	130nm interconnect	﹤4KA	· PETEOS · SiN · Silox · Coral · Black Diamond
465	Cu damascene design similar to 800 maskset, extended down to 90nm	200mm, 300mm	90nm interconnect	﹤3KA	· PETEOS · SiN · Silox · Coral · Black Diamond

METROLOGY

MASK SET	PRODUCT DESCRIPTION	WAFER SIZE	MINIMUM FEATURE SIZE	TYPICAL ETCH DEPTH	TYPICAL FILMS AVAILABLE
AMAG4L	Metrology pattern containing the following features: cleavable line/space from 50 to 1000nm, cleavable contacts from 150 to 1000nm, scatterometry structures, electrical LW structures, alignment targets and LER structures.	200 mm & 300mm	80nm L/S, 60nm isoL	request	request
AMAG5L	Metrology pattern containing the following features: cleavable line/space from 30 to 250nm, cleavable contacts from 80 to 250nm, dummy fill patterns, line end shortening structures, alignment targets, scatterometry structures, phase imbalance structures and LER structures.	200mm, 300mm	70nm L/S, 45nm isoL	request	request
OMAG4	Designed to characterize optical overlay measurements and for use in the development of new optical overlay techniques.	200 mm 300 mm	100nm L/S	request	request

TSV ETCH/FILL

MASK SET	PRODUCT DESCRIPTION	WAFER SIZE	MINIMUM FEATURE SIZE	TYPICAL ETCH DEPTH	TYPICAL FILMS AVAILABLE
TSV	193 TSV reticle field. Circular contact holes varying in diameter from 1 to 100um. Spacing includes 1:1, 1:2, 1:5 and ISO – both staggered and linear. Also includes structures with fixed spacing of 1um and 10um.	200 mm	1um		Si
1XTSV	1X TSV mask. Circular contact holes varying in diameter from 1 to 100um. Spacing includes 1:1, 1:2, 1:5 and ISO – both staggered and linear. Also includes structures with fixed spacing of 1um and 10um. Note: Vias smaller than 5um are considered subnominal on this mask.	200 mm	6um		Si

CALIBRATION

MASK SET	PRODUCT DESCRIPTION	WAFER SIZE	MINIMUM FEATURE SIZE	TYPICAL ETCH DEPTH	TYPICAL FILMS AVAILABLE
Defect Calibration	Skorpios manufactures custom defect tool calibration wafers for many major equipment suppliers. Contact us for help in designing for your needs.	200 mm & 300 mm	request	request	request
Stage Movement Calibration	Skorpios manufactures custom stage calibration wafers for many major equipment suppliers. Contact us for help in designing for your needs.	200 mm & 300 mm	request	request	request
Optical Contrast Calibration	Skorpios manufactures custom stage calibration wafers for many major equipment suppliers. Contact us for help in designing for your needs.	200 mm & 300 mm	request	request	request

GENERAL PURPOSE

MASK SET	PRODUCT DESCRIPTION	WAFER SIZE	MINIMUM FEATURE SIZE	TYPICAL ETCH DEPTH	TYPICAL FILMS AVAILABLE
QCD	Cleavable line/space features from 100 to 2000nm with variable pitch. Electrically testable features are included.	200 mm & 300 mm	100nm	request	request
QCE	Cleavable contact features from 140 to 600nm with variable pitch.	200 mm & 300 mm	160nm	request	request
401	Cleavable metrology pattern from 70nm to 500nm. Contains nine line/trench structures, nine electrically testable line width structures, six scatterometry structures, and eight VHorgs.	200 mm & 300 mm	90nm	request	request
MEMS-RES	1X resolution mask contains lines, spaces, vias and posts with variable pitch. Also includes fluidics structures and other representative MEMs patterns	200 mm	5um	request	request

Product Inquiry